Hamamatsu Photonics hat das Thermodynamic Imaging (TDI) in seiner Femto-Serie eingeführt. Diese Technologie ermöglicht die präzise Lokalisierung von Defekten in metallhaltigen Halbleitern. Durch die patentierte Laser-Scan-Technologie wird das Signal-Rausch-Verhältnis um das 38-fache verbessert, was zu hoher Präzision und Zuverlässigkeit in der Wärmebildgebung führt.
Hamamatsu Photonics führt Thermodynamic Imaging (TDI) für seine Phemos-Serie ein. Sie ermöglicht die Lokalisierung von Defekten in Halbleitern mit Metallanteilen. Die patentierte Laser-Scan-Technologie verbessert das Signal-Rausch-Verhältnis (SNR) um das 38-fache und sorgt für hohe Präzision und Zuverlässigkeit in der Wärmebildgebung.
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